Interlink Electronics (NASDAQ: LINK) is a leading provider of sensors and printed electronic solutions, boasting 40 years of success in delivering mission-critical technologies across diverse markets. Its customers, including global blue-chip companies, trust the company’s products and solutions, which span various sectors, including medical, industrial, automotive, wearables, IoT, and other specialty markets. Interlink’s expertise in materials science, manufacturing, embedded electronics, firmware, and software enables the company to create custom solutions tailored to customers’ unique needs.
The company serves its international customer base from its corporate headquarters and proprietary gas sensor production and product development facility in Fremont, California (Silicon Valley area); its advanced printed-electronics manufacturing center in Shenzhen, China; and its multiple facilities in Irvine, Scotland, and its smart textile and wearables product development footprint located in the Evolution Advanced Manufacturing Park in Rotherham, England.
“We are excited to present at Moody Conference,” said Steven N. Bronson, CEO of Interlink Electronics. “Interlink continues to expand across attractive end markets, and events like this allow us to connect with investors, share our growth strategy, and outline the path ahead for profitable growth.”
To register to attend, visit: https://moodycapital.com/conference/
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About Moody Capital Solutions Inc.
Moody Capital Solutions is an independent, full-service investment bank with more than 40 years of experience in capital raising, M&A, and advisory services, and is recognized as a market leader in rights offerings. Member FINRA/SIPC. www.moodycapital.com
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